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| TC1268 500mA Fixed Output, Fast Response CMOS LDO with Shutdown Features * * * * * * * * Very Low Dropout Voltage 500mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Over Current and Over Temperature Protection SHDN Input for Active Power Management ERROR Output to Detect Low Battery 5sec (typical) Wake-up Time from SHDN General Description The TC1268 is a fixed output, fast turn-on, high accuracy (typically 0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1268's CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80A at full load (20 to 60 times lower than in bipolar regulators). TC1268's key features include ultra low noise, very low dropout voltage (typically 350mV at full load), and fast response to step changes in load. The TC1268 also has a fast wake-up response time (5sec typically) when released from shutdown. The TC1268 incorporates both over temperature and over current protection. The TC1268 is stable with an output capacitor of only 1F and has a maximum output current of 500mA. Applications * * * * * * * * * RAMBUS Memory Module Battery-Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulator for SMPS Pagers Digital Cameras Typical Application VIN VIN VOUT + VOUT COUT 1F SHDN TC1268 GND SHDN Device Selection Table Part Number TC1268-2.5VOA Output* Voltage Package (V) 2.5 Junction Temp. Range 8-Pin SOIC -40C to +125C *Other output voltages and package options are available. Please contact Microchip Technology Inc. for details. Package Type 8-Pin SOIC VOUT GND NC BYPASS 1 2 3 4 8 7 VIN NC SHDN ERROR TC1268 6 5 2002 Microchip Technology Inc. DS21379B-page 1 (c) TC1268 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Input Voltage .........................................................6.5V Power Dissipation................Internally Limited (Note 6) Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V Operating Temperature ............... -40C < TJ < +125C Storage Temperature.......................... -65C to +150C *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1268 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 100A, CL = 3.3F, SHDN > VIH , TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40C to +125C. Symbol VIN IOUTMAX VOUT VOUT/T VOUT/VIN VOUT/VOUT VIN-VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage Min 2.7 500 Typ -- -- Max 6.0 -- -- VR + 2.5% -- 0.35 0.01 30 160 480 800 130 -- 10 Units V mA V ppm/C % %/mA mV Note 1 Note 2 (VR + 1V) VIN 6V IL = 0.1mA to IOUTMAX (Note 3) IL = 100A IL = 100mA IL = 300mA IL = 500mA (Note 4) SHDN = VIH, IL = 0 SHDN = 0V VIN = 3.5V, VOUT = 2.5V CIN = COUT = 1F IL = 250mA (See Figure 3-2) VIN = 3.5V, VOUT = 2.5V CIN = COUT = 1F IL = 250mA (See Figure 3-2) FRE 1kHz VOUT = 0V Note 5 IL = IOUTMAX Test Conditions Note 8 -- VR 0.5% VR - 2.5% -- -- -- -- -- -- -- -- -- -- -- 40 0.05 0.002 20 60 200 350 80 5 5 IDD ISHDN TWK Supply Current (Active Mode) Supply Current (Shutdown Mode) Wake-up Time (from Shutdown Mode) A A sec TS Settling Time (from Shutdown Mode) -- 15 -- sec PSRR IOUTSC VOUT/PD eN SHDN Input VIH VIL Note 1: 2: 3: Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise SHDN Input High Threshold SHDN Input Low Threshold VR is the regulator output voltage setting. TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T -- -- -- -- 45 -- 64 1200 0.04 260 -- -- -- 1400 -- -- -- 15 dB mA V/W nV/Hz %VIN %VIN 4: 5: 6: 7: 8: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. Hysteresis voltage is referenced to VR. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX. (c) DS21379B-page 2 2002 Microchip Technology Inc. TC1268 TC1268 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN = VOUT + 1V, IL = 100A, CL = 3.3F, SHDN > VIH , TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40C to +125C. ERROR Output VMIN VOL VTH Note 1: 2: 3: Minimum Operating Voltage Output Logic Low Voltage ERROR Threshold Voltage VR is the regulator output voltage setting. TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T 1.0 -- -- -- -- 0.95 x VR -- 400 -- V mV V 1 mA Flows to ERROR 4: 5: 6: 7: 8: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. Hysteresis voltage is referenced to VR. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX. 2002 Microchip Technology Inc. DS21379B-page 3 (c) TC1268 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (8-Pin SOIC) 1 2 3 4 5 6 PIN FUNCTION TABLE Symbol VOUT GND NC BYPASS ERROR SHDN Regulated voltage output. Ground terminal. No connect. Reference bypass input. Connecting a 470pF to this input further reduces output noise. Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance by approximately -5%. Shutdown control input. The regulator is fully enabled when a logic high is applied to this input. The regulator enters shutdown when a logic low is applied to this input. During shutdown, output voltage falls to zero and supply current is reduced to 5A (typical). No connect. Unregulated supply input. Description 7 8 NC VIN 3.0 DETAILED DESCRIPTION The TC1268 is a precision, fixed output LDO. Unlike bipolar regulators, the TC1268 supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to ILOADMAX load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. The total turn on response is defined as the Settling Time (TS), see Figure 3-2. Settling Time (inclusive with TWK) is defined as the condition when the output is within 2% of its fully enabled value (15sec typical) when released from shutdown. The settling time of the output voltage is dependent on load conditions and output capacitance on VOUT (RC response). The Wake-up Time (TWK) is an important parameter to consider when using the TC1268 in RAMBUS applications. In this application, the bus voltage is held at 2.5V by a switching regulator during normal power conditions and can be switched to low power mode, where the TC1268 takes over and supplies the same 2.5V, but at a much lower current (300mA). In order to not see the bus voltage drop during the transition from high power to low power, the TC1268 has a very fast wake-up time of 5sec to support the 2.5V rail. This makes the TC1268 ideal for applications involving RAMBUS. FIGURE 3-1: TYPICAL APPLICATION CIRCUIT + CIN 1F VIN VOUT + VOUT COUT 1F ON SHDN OFF V+ R1 1M ERROR + C1 0.2F + Battery - TC1268 SHDN BYP CBYP 10nF GND FIGURE 3-2: WAKE-UP RESPONSE TIME VIH C1 required only if ERROR is used as a processor RESET signal (See Text) 3.1 Turn On Response SHDN VIL TS 98% The turn on response is defined as two separate response categories, Wake-up Time (TWK) and Settling Time (TS). The TC1268 has a fast Wake-up Time (5sec typical) when released from shutdown. See Figure 3-2 for the Wake-up Time designated as TWK. The Wake-up Time is defined as the time it takes for the output to rise to 2% of the VOUT value after being released from shutdown. VOUT 2% TWK (c) DS21379B-page 4 2002 Microchip Technology Inc. TC1268 3.2 Bypass Input 3.4 ERROR Output A 10nF capacitor connected from the bypass input to ground reduces noise present on the internal reference, which in turn, significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but this results in a longer time period to achieve the rated output voltage, once power is initially applied. ERROR is driven low whenever VOUT falls out of regulation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting, or thermal limiting. The ERROR threshold is 5% below rated VOUT, regardless of the programmed output voltage value (e.g., ERROR = VOL at 2.375V (typ.) for a 2.5V regulator). ERROR output operation is shown in Figure 3-3. Note that ERROR is active when VOUT is at or below VTH, and inactive when VOUT is above V TH + VH. As shown in Figure 3-1, ERROR can be used as a battery low flag, or as a processor RESET signal (with the addition of timing capacitor C1). R1 x C1 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200msec to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V). 3.3 Output Capacitor A 1F (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1 and less than 5, and a resonant frequency above 1MHz. A 1F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.) When operating from sources other than batteries, supply noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. FIGURE 3-3: VOUT ERROR OUTPUT OPERATION VTH Hysteresis (VH) ERROR VIH VOL 2002 Microchip Technology Inc. DS21379B-page 5 (c) TC1268 4.0 4.1 THERMAL CONSIDERATIONS Thermal Shutdown Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.3V 10% VOUTMIN = 2.5V 0.5% ILOADMAX = 275mA TJMAX TAMAX JA = 125C = 95C = 60C/W Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C. 4.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD (VINMAX - VOUTMIN)ILOADMAX = [(3.3 x 1.1) - (2.5 x .995)]275 x 10-3 = 314mW Maximum allowable power dissipation: PDMAX = (TJMAX - TAMAX) JA = (125 - 95) 60 = 500mW In this example, the TC1268 dissipates a maximum of 314mW; below the allowable limit of 500mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 500mW into Equation 4-1, from which VINMAX = 3.94V. EQUATION 4-1: PD (VINMAX - VOUTMIN)ILOADMAX Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on V IN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). EQUATION 4-2: PDMAX = (TJMAX - TAMAX) JA Where all terms are previously defined. Table 4-1 shows various values of JA for the TC1268 package. TABLE 4-1: THERMAL RESISTANCE GUIDELINES FOR TC1268 IN 8-PIN SOIC PACKAGE Copper Area (Backside) Board Area Thermal Resistance (JA) 60C/W 60C/W 68C/W 74C/W Copper Area (Topside)* 2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 2500 sq mm 2500 sq mm 225 sq mm 100 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 2500 sq mm *Pin 2 is ground. Device is mounted on topside. (c) DS21379B-page 6 2002 Microchip Technology Inc. TC1268 5.0 Note: TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Fast Response TC1268 Fast Response TC1268 SHDN Conditions: VOUT = 2.50V VIN = 3.50V CIN = COUT = 1F RLOAD = 10 SHDN Conditions: VOUT = 2.50V VIN = 3.50V CIN = COUT = 1F RLOAD = 10 VOUT VOUT 100sec/DIV; 15sec Rise Time 10sec/DIV; 15sec Rise Time 2002 Microchip Technology Inc. DS21379B-page 7 (c) TC1268 6.0 6.1 PACKAGING INFORMATION Package Marking Information Package marking data not available at this time. 6.2 Taping Form Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin SOIC (N) 12 mm 8 mm 2500 13 in 6.3 Package Dimensions 8-Pin SOIC PIN 1 .157 (3.99) .150 (3.81) .244 (6.20) .228 (5.79) .050 (1.27) TYP. .197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) .010 (0.25) .007 (0.18) .050 (1.27) .016 (0.40) Dimensions: inches (mm) 8 MAX. . (c) DS21379B-page 8 2002 Microchip Technology Inc. TC1268 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21379B-page 9 TC1268 NOTES: DS21379B-page 10 2002 Microchip Technology Inc. TC1268 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. DS21379B-page 11 (c) WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Rocky Mountain 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. 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Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 05/01/02 (c) DS21379B-page 12 2002 Microchip Technology Inc. *B97312SD* |
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